At March, it's reported that apple is planing using PCB board and new SiP packaging technology on next generation iPhone. The battery space will be larger than before with this new packaging technology.
SiP is a system-level packaging technology, with this technology the processors, co-processors, memory, storage, and even sensors are integrated together in a small space, no longer need the traditional PCB circuit board, allowing the phone to make even more slim body, and then a larger capacity battery can be put in the inside of the iPhone. But the disadvantage is, the entire SiP package can not be used if there is a damaged module, this will reduce the yield.
According to information from the supply chain, it said Taiwan manufacturers have gained iPhone 6s / 6s Plus the SiP orders, and in order to meet the needs of Apple's growing SiP has begun mass production this month. It is reported that this year's new iPhone will not all use SiP, but co-exist with PCB, to which it is expected to be gradually reduced until completely eliminated next year. Apart from the SiP packaging technology, iPhone 6s of the highlights will include the new Force Touch pressure touch and 7000 series aluminum body and other characteristics.
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